Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios

ABSTRACT

The invention provides a chemical-mechanical polishing composition comprising a cationic abrasive, a cationic polymer, a carboxylic acid, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition exhibits selectivity for removal of silicon nitride over removal of silicon oxide.

FIELD OF THE INVENTION

This invention pertains to a polishing composition and a method forpolishing a substrate using the same.

BACKGROUND OF THE INVENTION

As a method for isolating elements of a semiconductor device, a greatdeal of attention is being directed towards a shallow trench isolation(STI) process where a silicon nitride layer is formed on a siliconsubstrate, shallow trenches are formed via etching or photolithography,and a dielectric layer is deposited to fill the trenches. Due tovariation in the depth of trenches, or lines, formed in this manner, itis typically necessary to deposit an excess of dielectric material ontop of the substrate to ensure complete filling of all trenches.

The excess dielectric material (e.g., an oxide) is then typicallyremoved by a chemical-mechanical planarization process to expose thesilicon nitride layer. When the silicon nitride layer is exposed, thelargest area of the substrate exposed to the chemical-mechanicalpolishing system comprises silicon nitride, which must then be polishedto achieve a highly planar and uniform surface. Generally, past practicehas been to emphasize selectivity for oxide polishing in preference tosilicon nitride polishing. Thus, the silicon nitride layer has served asa stopping layer during the chemical-mechanical planarization process,as the overall polishing rate has decreased upon exposure of the siliconnitride layer. However, as oxide line widths have become smaller innext-generation devices, in some circumstances it is desirable toutilize polishing systems having selectivity for silicon nitride overoxide polishing, in order to minimize defectivity in the oxide linesformed on the substrate surface.

Compositions and methods for planarizing or polishing the surface of asubstrate are well known in the art. Polishing compositions (also knownas polishing slurries) typically contain an abrasive material in aliquid carrier and are applied to a surface by contacting the surfacewith a polishing pad saturated with the polishing composition. Typicalabrasive materials include silicon dioxide, cerium oxide, aluminumoxide, zirconium oxide, and tin oxide. U.S. Pat. No. 5,527,423, forexample, describes a method for chemically-mechanically polishing ametal layer by contacting the surface with a polishing slurry comprisinghigh purity fine metal oxide particles in an aqueous medium. Polishingcompositions are typically used in conjunction with polishing pads(e.g., a polishing cloth or disk). Suitable polishing pads are describedin U.S. Pat. Nos. 6,062,968, 6,117,000, and 6,126,532, which disclosethe use of sintered polyurethane polishing pads having an open-celledporous network, and U.S. Pat. No. 5,489,233, which discloses the use ofsolid polishing pads having a surface texture or pattern. Instead of orin addition to being suspended in the polishing composition, theabrasive material may be incorporated into the polishing pad. U.S. Pat.No. 5,958,794 discloses a fixed abrasive polishing pad.

Several chemical-mechanical polishing compositions for substratescontaining low dielectric constant materials (e.g., oxide) are known.For example, U.S. Pat. No. 6,043,155 discloses a cerium oxide-basedslurry for inorganic and organic insulating films, having selectivityfor silicon dioxide versus silicon nitride polishing. U.S. patentapplication Publication Ser. 2002/0168857 A1 discloses a method formanufacturing a semiconductor device in which silicon dioxide isdeposited on a silicon nitride film patterned with trenches, and atwo-stage chemical-mechanical polishing process is then performed toselectively remove overlying silicon dioxide, thus leaving trenchesfilled with silicon dioxide. Thus, there remains a need in the art forpolishing compositions and methods having the reverse selectivity, forpolishing of silicon nitride over underlying dielectric components.

The invention provides such a composition and method. These and otheradvantages of the invention, as well as additional inventive features,will be apparent from the description of the invention provided herein.

BRIEF SUMMARY OF THE INVENTION

The invention provides a chemical-mechanical polishing compositioncomprising (a) a cationic abrasive, (b) a cationic polymer selected fromthe group consisting of (1) about 0.1 ppm to about 50 ppm of a cationichomopolymer, (2) about 0.1 ppm to about 50 ppm of a cationic copolymercomprising at least one cationic monomer and at least one nonionicmonomer, wherein the at least one cationic monomer comprises more than50% of the cationic copolymer on a molar basis, and (3) about 0.1 ppm toabout 200 ppm of a cationic copolymer comprising at least one cationicmonomer and at least one nonionic monomer, wherein the at least onecationic monomer comprises 50% or less of the copolymer on a molarbasis, and (c) water, wherein the polishing composition has a pH ofabout 7 or less. The invention further provides a method ofchemically-mechanically polishing a substrate comprising (i) contactinga substrate with a polishing pad and a chemical-mechanical polishingcomposition comprising (a) a cationic abrasive, (b) a cationic polymerselected from the group consisting of (1) about 0.1 ppm to about 50 ppmof a cationic homopolymer, (2) about 0.1 ppm to about 50 ppm of acationic copolymer comprising at least one cationic monomer and at leastone nonionic monomer, wherein the at least one cationic monomercomprises more than 50% of the cationic copolymer on a molar basis, and(3) about 0.1 ppm to about 200 ppm of a cationic copolymer comprising atleast one cationic monomer and at least one nonionic monomer, whereinthe at least one cationic monomer comprises 50% or less of the copolymeron a molar basis, and (c) water, (ii) moving the polishing pad relativeto the substrate with the chemical-mechanical polishing compositiontherebetween, and (iii) abrading at least a portion of the substrate topolish the substrate.

DETAILED DESCRIPTION OF THE INVENTION

The invention provides a chemical-mechanical polishing compositioncomprising (a) a cationic abrasive, (b) a cationic polymer (e.g.,homopolymer or copolymer), and (c) water. The polishing compositiondesirably allows for selective removal of silicon nitride in preferenceto silicon dioxide during planarization of substrates comprising siliconnitride and silicon dioxide.

The polishing composition comprises a cationic abrasive. A cationicabrasive, in the context of the invention, comprises abrasive particleshaving a positive surface charge at the pH of the polishing composition.The surface charge of an abrasive particle can vary with pH. A desirablecationic abrasive is a cationic metal oxide abrasive. Preferably, thecationic metal oxide abrasive is selected from the group consisting ofceria, alumina, zirconia, titania, doped silica, and mixtures thereof.More preferably, the abrasive is ceria or zirconia. Most preferably, theabrasive is ceria.

The cationic metal oxide abrasive can be produced by any suitableprocess. Suitable processes for producing cationic metal oxide abrasiveparticles useful in the context of the invention include pyrogenic andhydrothermal processes. Fumed metal oxides can be produced from volatileprecursors (e.g., metal halides) in a pyrogenic process by hydrolysisand/or oxidation of the precursors in a high temperature flame (H₂/airor H₂/CH₄/air) to produce the metal oxide of interest. Fumed metaloxides can be prepared from nonvolatile precursors by dissolving ordispersing the precursor in a suitable solvent such as water, alcohol,or acid-based solvent. The solution containing the precursor can besprayed into a high temperature flame using a droplet generator, and themetal oxide can then be collected. Typical droplet generators includebi-fluid atomizers, high-pressure spray nozzles, and ultrasonicatomizers.

The cationic metal oxide abrasive can be a doped silica, for example,alumina-doped silica. Alumina-doped silicas are generally prepared by aco-fuming process in which mixtures of silicon tetrachloride andaluminum chloride are subjected to vapor phase hydrolysis, thus formingcomposite particles comprising aluminum oxide and silicon dioxide.Generally, silica particles have a negative, or anionic, surface charge,at a pH above the isoelectric point of the silica partices (e.g., aboutpH 3.5 or higher). The presence of an appropriate second metal oxide(e.g., aluminum oxide) renders the doped silica particles cationic.Desirably, about 0.01 wt. % or more (e.g., about 0.2 wt. % or more, orabout 0.3 wt. % or more) of a second metal oxide is present in the dopedsilica particles. Preferably, about 2 wt. % or less (e.g., about 1.5 wt.% or less, or about 1 wt. % or less) of a second metal oxide is presentin the doped silica particles. Examples of alumina-doped silicas are theMOX 80 and MOX 170 products (both containing about 1 % alumina)available from Degussa.

As noted above, the cationic metal oxide abrasive can be produced by ahydrothermal process. In a hydrothermal process, a metal salt (e.g., anitrate) having the same oxidation level as the desired metal oxide isdissolved in water, treated with a base (e.g., ammonium hydroxide), andsubjected to conditions of elevated temperature and pressure. Thehydrothermal process results in the conversion of the metal salt intothe corresponding metal oxide.

Alternatively, a metal salt having a lower oxidation level than thedesired metal oxide can be used in conjunction with an oxidizing agentin a hydrothermal process. For example, U.S. Pat. No. 5,389,352discloses a process for preparing cerium oxide, which process comprisesforming an aqueous solution comprised of a water-soluble trivalentcerium salt and an oxidizing agent, and then aging the solution as aliquid phase for a time during which the trivalent cerium salt isoxidized to cerium oxide particles.

Dopants comprising a second metal salt can be added to the first metalsalt during a hydrothermal process to produce a doped metal oxidecontaining the second metal compound. Preferred dopants are selectedfrom the group consisting of nickel, cobalt, manganese, iron, aluminum,chromium, and zinc. Any suitable amount of the second metal salt can beadded to the first metal salt during the execution of a hydrothermalprocess. If a dopant is desired, typically about 1 ppm or more (e.g.,about 10 ppm or more, or about 50 ppm or more, or even about 100 ppm ormore) of a dopant can be added to the first metal salt during ahydrothermal process. Preferably, about 10000 ppm or less (e.g., about5000 ppm or less, or about 1000 ppm or less, or about 500 ppm or less)of a dopant can be added to the first metal salt during a hydrothermalprocess.

The cationic abrasive particles desirably have an average particle size(typically, average particle diameter of the smallest spheresencompassing the particles) of at least about 10 nm or more (e.g., about10 to about 1000 nm). Preferably, the abrasive particles have an averageparticle size of about 50 nm or more (e.g., about 50 to about 500 nm, oreven about 50 to about 300 nm). More preferably, the abrasive particleshave an average particle size of about 1000 nm or less (e.g., about 800nm or less, or about 500 nm or less, or even about 300 nm or less).

The cationic abrasive can be present in the polishing composition in anysuitable amount. The amount of cationic abrasive present in thepolishing composition typically is about 0.001 wt. % or more (e.g.,about 0.005 wt. % or more, or about 0.01 wt. % or more) based on theweight of the liquid carrier and any components dissolved or suspendedtherein. The amount of cationic abrasive present in the polishingcomposition preferably is about 5 wt. % or less (e.g., about 2 wt. % orless, or about 1 wt. % or less) based on the weight of the liquidcarrier and any components dissolved or suspended therein. Morepreferably, the amount of cationic abrasive present in the polishingcomposition is about 0.01 wt. % to about 1 wt. %.

The abrasive desirably is suspended in the polishing composition, morespecifically in the water component of the polishing composition. Whenthe abrasive is suspended in the polishing composition, the abrasivepreferably is colloidally stable. The term colloid refers to thesuspension of abrasive particles in the liquid carrier. Colloidalstability refers to the maintenance of that suspension over time. In thecontext of this invention, an abrasive is considered colloidally stableif, when the abrasive is placed into a 100 ml graduated cylinder andallowed to stand unagitated for a time of 2 hours, the differencebetween the concentration of particles in the bottom 50 ml of thegraduated cylinder ([B] in terms of g/ml) and the concentration ofparticles in the top 50 ml of the graduated cylinder ([T] in terms ofg/ml) divided by the initial concentration of particles in the abrasivecomposition ([C] in terms of g/ml) is less than or equal to 0.5 (i.e.,{[B]-[T]}/[C]≦0.5). The value of [B]-[T]/[C] desirably is less than orequal to 0.3, and preferably is less than or equal to 0.1.

The polishing composition comprises a cationic polymer. The cationicpolymer can be any suitable cationic polymer. The cationic polymer canbe a cationic homopolymer or a cationic copolymer. The purpose of thecationic polymer is to reduce the removal rate of silicon dioxide ascompared to the removal rate of silicon nitride for substratescomprising silicon dioxide and silicon nitride achievable by thepolishing composition of the invention. Without wishing to be bound byany particular theory, it is believed that the cationic polymer ispreferentially adsorbed onto the surface of the silicon dioxide. Thecationic polymer is believed to form a protective film on the silicondioxide surface to inhibit contact of the polishing composition with thesilicon dioxide surface, thereby reducing the removal rate of silicondioxide while advantageously not significantly affecting the rate ofsilicon nitride removal.

The cationic homopolymer can be any suitable cationic homopolymerconsisting essentially of cationic monomer repeat units. For example,the cationic polymer can be any suitable cationic polymer consistingessentially of cationic repeat units comprising nitrogen, including butnot limited to monomers comprising basic amine groups and quaternizedamine groups. The basic amine groups or quaternized amine groups can beacyclic or incorporated into a ring structure. It is also suitable forthe cationic polymer to be further modified by alkylation, acylation,ethoxylation, or other chemical reaction, in order to alter thesolubility, viscosity, or other physical parameter of the cationicpolymer. Preferably, the cationic polymer is selected from the groupconsisting of polyethyleneimine, ethoxylated polyethyleneimine,polydiallyldimethylammonium halide, poly(amidoamine),poly(methacryloxyloxyethyltrimethylammonium) chloride,poly(methacryloyloxyethyldimethylbenzylammonium) chloride,poly(vinylpyrrolidone), poly(vinylimidazole), poly(vinylpyridine), andpoly(vinylamine). More preferably, the cationic polymer ispolyethyleneimine.

The cationic polymer can be any suitable cationic homopolymer consistingessentially of monomers comprising sulfonium groups. Sulfonium groupscomprise a sulfur atom substituted with three carbon atoms, with thesulfur atom having a positive charge. Non-limiting examples of cationicpolymers and cationic monomers comprising sulfonium groups are disclosedin U.S. Pat. No. 4,528,384.

The cationic polymer can be any suitable cationic homopolymer consistingessentially of monomers comprising phosphonium groups. Phosphoniumgroups comprise a phosphorous atom substituted with four carbon atoms,with the phosphorous atom having a positive charge. Non-limiting exampleof cationic polymers and cationic monomers comprising phosphonium groupsare disclosed in U.S. Pat. No. 5,439,617.

The cationic homopolymer can be any suitable transition metal oligomerhaving a net positive charge. For example, aluminum compounds can formcationic oligomeric species such as “poly-aluminum chloride,” whichrefers to a class of soluble aluminum products in which aluminumchloride has been partly reacted with base, and which contains some ofthe highly cationic oligomers of aluminum. Other non-limiting examplesof transition metal oligomers are found in, for example, “ComprehensiveOrganometallic Chemistry II,” E. W. Abelm, F. G. A. Stone, and G.Wilkinson, eds., Pergamon Press (1995).

The cationic polymer can be a copolymer comprising at least one cationicmonomer and at least one nonionic monomer, wherein the at least onecationic monomer comprises either more than 50% of the copolymer on amolar basis or about 50% or less of the copolymer on a molar basis. Thecationic and nonionic monomers can be any suitable cationic and nonionicmonomers.

For example, the cationic monomer can be any suitable cationicmonomer(s) comprising nitrogen, including but not limited to monomerscomprising basic amine groups and quaternized amine groups. The basicamine groups or quaternized amine groups can be acyclic or can beincorporated into a ring structure. Examples of cationic monomers usefulin the context of the invention include but are not limited toethyleneimine, diallyldimethylammonium halide,methacryloxyloxyethyltrimethylammonium chloride,methacryloyloxyethyldimethylbenzylammonium chloride, 2-aminoethylmethacrylate, N-(3-aminopropyl)methacrylate, vinylimidazole,vinylpyridine, vinylamine, and amidoamines. The cationic monomers cancomprise sulfonium and phosphonium groups. Sulfonium groups andphosphonium groups suitable for incorporation into the copolymers can beas set forth above. Preferably, the cationic monomer is ethyleneimine.

The nonionic monomer, for example, can be any suitable nonionicmonomer(s), including but not limited to ethylene, propylene, ethyleneoxide, propylene oxide, styrene, epichlorohydrin, acrylamide, andmixtures thereof.

The cationic copolymer can be prepared by any suitable technique. Forexample, the copolymer can be produced by free radical, cationic,anionic, or condensation polymerization. The copolymer can be a randomcopolymer, alternating copolymer, periodic copolymer, block copolymer(e.g., AB, ABA, ABC, etc.), graft copolymer, or comb copolymer. Thecationic copolymer can be further modified by alkylation, acylation,ethoxylation, or other chemical reaction, in order to alter thesolubility, viscosity, or other physical parameter of the copolymer.

The cationic polymer (i.e., cationic homopolymer or copolymer) can haveany suitable average molecular weight. Preferably, the cationic polymerwill have an average molecular weight of about 1,000 Daltons or more(e.g., about 5,000 Daltons or more, or about 10,000 Daltons or more, orabout 50,000 Daltons or more, or even about 100,000 Daltons or more).

The amount of cationic polymer in the polishing composition depends onthe nature of the cationic polymer. When the cationic polymer is acationic homopolymer or a cationic copolymer comprising at least onecationic monomer and at least one nonionic monomer, wherein the cationicmonomer comprises more than 50% of the cationic copolymer on a molarbasis, then the amount of cationic polymer in the polishing compositionis about 0.1 ppm to about 50 ppm based on the total weight of thepolishing composition. Typically, the amount of cationic polymer will beabout 0.5 ppm or more (e.g., about 1 ppm or more). Thus, the amount ofcationic polymer in the polishing composition can be about 0.5 ppm toabout 45 ppm (e.g., about 1 ppm to about 40 ppm), or about 2 ppm toabout 35 ppm (e.g., about 3 ppm to about 30 ppm). When the cationicpolymer is a cationic copolymer comprising at least one cationic monomerand at least one nonionic monomer, wherein the cationic monomercomprises 50% or less of the cationic copolymer on a molar basis, theamount of cationic polymer in the polishing composition can be about 0.1ppm to about 200 ppm, based on the total weight of the polishingcomposition. In such an embodiment, typically the amount of cationicpolymer will be about 0.1 ppm to about 200 ppm (e.g., about 5 ppm toabout 200 ppm), or about 10 ppm to about 150 ppm (e.g., about 20 ppm toabout 100 ppm). If the amount of the cationic polymer in the polishingcomposition is too low, then no effect resulting from addition of thecationic polymer is observed. If the amount of the cationic polymer inthe polishing composition is too high, then suppression of siliconnitride removal occurs, thus lowering the ratio of silicon nitrideremoval to that of silicon dioxide removal, as well as reducing theoverall polishing rate for the substrate below useful levels.

The cationic homopolymers and cationic copolymers of the invention allowfor similar selectivity for removal of silicon nitride in preference tosilicon dioxide in the chemical-mechanical polishing of substratescomprising silicon nitride and silicon oxide. Generally, the use ofhigher concentrations of the cationic copolymers in polishingcompositions is required to achieve similar polishing performance ascompared to polishing compositions comprising cationic homopolymers.Despite possible disadvantages of a requirement for use of largeramounts of cationic copolymers as compared to cationic homopolymers inpolishing compositions, such as cost and supply requirements, thegreater precision achievable in formulation of the polishingcompositions having higher concentrations of cationic copolymers duringthe manufacturing process may be advantageous in some circumstances.

The polishing composition has a pH of about 7 or less (e.g., about 6 orless). Preferably, the polishing composition has a pH of about 1 or more(e.g., about 2 or more, or about 3 or more). Even more preferably, thepolishing composition has a pH of about 4 to about 7 (e.g., about 4 toabout 6). The polishing composition optionally comprises pH adjustingagents, for example, potassium hydroxide, ammonium hydroxide,alkylammonium hydroxides, and/or nitric acid. The polishing compositioncan optionally comprise pH buffering systems, for example, ammoniumacetate or disodium citrate. Many such pH buffering systems are wellknown in the art.

The polishing composition optionally further comprises a carboxylicacid. Carboxylic acids useful in the polishing composition includemonocarboxylic and dicarboxylic acids and their salts. The carboxylicacid can further comprise functional groups selected from the groupconsisting of hydroxyl, carbonyl, halogen, amine, andnitrogen-containing aromatic heterocycle. Preferably, the carboxylicacid is selected from the group consisting of acetic acid, propionicacid, butyric acid, benzoic acid, formic acid, malonic acid, succinicacid, tartaric acid, lactic acid, phthalic acid, salicylic acid,anthranilic acid, citric acid, glycolic acid, fumaric acid, lauric acid,pyruvic acid, stearic acid, chloroacetic acid, dichloroacetic acid,2-pyridinecarboxylic acid, 2-piperidinecarboxylic acid, glycine,alanine, 3-aminopropionic acid, 4-aminobutyric acid, derivativesthereof, salts thereof, and combinations thereof.

The polishing composition can comprise any suitable amount of thecarboxylic acid and when present typically comprises about 10 ppm ormore (e.g., about 10 to about 1000 ppm). Preferably, the amount ofcarboxylic acid present in the polishing composition will be about 1000ppm or less (e.g., about 800 ppm or less, or about 600 ppm or less).

It will be appreciated that the aforementioned carboxylic acids canexist in the form of a salt (e.g., a metal salt, an ammonium salt, orthe like), an acid, or as a partial salt thereof. For example, tartratesinclude tartaric acid, as well as mono- and di-salts thereof.Furthermore, carboxylic acids including basic functional groups canexist in the form of an acid salt of the basic functional group. Forexample, glycines include glycine, as well as monoacid salts thereof.Furthermore, some carboxylic acids can function both as an acid and as achelating agent (e.g., certain amino acids and the like).

The carboxylic acid serves several functions in the polishingcomposition. The carboxylic acid in conjunction with the cationicpolymer serves to confer selectivity for removal of silicon nitride inpreference to removal of silicon dioxide observed with the use of theinventive polishing composition by suppression of silicon dioxideremoval. The carboxylic acid further serves to buffer the pH of thesystem and improves the colloidal stability of the polishingcomposition.

The polishing composition optionally further comprises one or more otheradditives. Such additives include any suitable surfactant and/orrheolqgical control agent, including viscosity enhancing agents andcoagulants (e.g., polymeric rheological control agents, such as, forexample, urethane polymers), acrylates comprising one or more acrylicsubunits (e.g., vinyl acrylates and styrene acrylates), and polymers,copolymers, and oligomers thereof, and salts thereof. Suitablesurfactants include, for example, cationic surfactants, anionicsurfactants, anionic polyelectrolytes, nonionic surfactants, amphotericsurfactants, fluorinated surfactants, mixtures thereof, and the like.

The polishing composition optionally further comprises a biocide. Thebiocide can be any suitable biocide, for example an isothiazolinonebiocide. The amount of biocide used in the polishing compositiontypically is about 1 ppm to about 500 ppm, and preferably is about 10ppm to about 200 ppm.

The polishing composition can be prepared by any suitable technique,many of which are known to those skilled in the art. The polishingcomposition can be prepared in a batch or continuous process. Generally,the polishing composition can be prepared by combining the componentsthereof in any order. The term “component” as used herein includesindividual ingredients (e.g., acids, bases, etc.) as well as anycombination of ingredients (e.g., acids, bases, surfactants, etc.).

For example, the cationic abrasive can be dispersed in water. Thecationic homopolymer or copolymer and optional carboxylic acid can thenbe added, and mixed by any method that is capable of incorporating thecomponents into the polishing composition. The polishing composition canbe prepared prior to use, with one or more components, such as thecationic homopolymer or copolymer, added to the polishing compositionjust before use (e.g., within about 1 minute before use, or within about1 hour before use, or within about 7 days before use). The pH can beadjusted at any suitable time. The polishing composition also can beprepared by mixing the components at the surface of the substrate duringthe polishing operation.

The polishing composition also can be provided as a concentrate which isintended to be diluted with an appropriate amount of water prior to use.In such an embodiment, the polishing composition concentrate cancomprise a cationic abrasive, a cationic homopolymer or copolymer, acarboxylic acid, and water in amounts such that, upon dilution of theconcentrate with an appropriate amount of water, each component of thepolishing composition will be present in the polishing composition in anamount within the appropriate range recited above for each component.For example, the cationic abrasive, a cationic homopolymer or copolymer,and carboxylic acid can each be present in the concentrate in an amountthat is about 2 times (e.g., about 3 times, about 4 times, or about 5times) greater than the concentration recited above for each componentso that, when the concentrate is diluted with an equal volume of water(e.g., 2 equal volumes water, 3 equal volumes of water, or 4 equalvolumes of water, respectively), each component will be present in thepolishing composition in an amount within the ranges set forth above foreach component. Furthermore, as will be understood by those of ordinaryskill in the art, the concentrate can contain an appropriate fraction ofthe water present in the final polishing composition in order to ensurethat the cationic homopolymer or copolymer, optional carboxylic acid,and other suitable additives are at least partially or fully dissolvedin the concentrate.

The invention further provides a method of chemically-mechanicallypolishing a substrate comprising (i) contacting a substrate with apolishing pad and the polishing composition described herein, (ii)moving the polishing pad relative to the substrate with the polishingcomposition therebetween, and (iii) abrading at least a portion of thesubstrate to polish the substrate.

The method of the invention can be used to polish any suitablesubstrate, and is especially useful for polishing substrates comprisingsilicon nitride and silicon dioxide. Suitable substrates include wafersused in the semiconductor industry. The polishing composition isparticularly well-suited for planarizing or polishing a substrate thathas undergone shallow trench isolation (STI) processing. STI processingtypically involves providing a silicon substrate on which is deposited alayer of silicon nitride. Trenches are etched onto a substratecomprising an overlying layer of silicon nitride followingphotolithography, and an excess of silicon dioxide is deposited thereon.The substrate is then subjected to planarization until the surface layerof silicon nitride is substantially removed, such that the silicon oxideremaining in the trenches is approximately level with the edges of thetrenches. Desirably, the planarization or polishing is carried out inSTI processing with the polishing composition of the invention,preferably such that the silicon nitride is substantially removed andthe silicon dioxide is adequately planarized without excessive erosionof silicon dioxide within the trenches.

The polishing method of the invention is particularly suited for use inconjunction with a chemical-mechanical polishing (CMP) apparatus.Typically, the apparatus comprises a platen, which, when in use, is inmotion and has a velocity that results from orbital, linear, or circularmotion, a polishing pad in contact with the platen and moving with theplaten when in motion, and a carrier that holds a substrate to bepolished by contacting and moving relative to the surface of thepolishing pad. The polishing of the substrate takes place by thesubstrate being placed in contact with the polishing pad and thepolishing composition of the invention and then the polishing pad movingrelative to the substrate, so as to abrade at least a portion of thesubstrate to polish the substrate.

A substrate can be planarized or polished with the chemical-mechanicalpolishing composition with any suitable polishing pad (e.g., polishingsurface). Suitable polishing pads include, for example, woven andnon-woven polishing pads. Moreover, suitable polishing pads can compriseany suitable polymer of varying density, hardness, thickness,compressibility, ability to rebound upon compression, and compressionmodulus. Suitable polymers include, for example, polyvinylchloride,polyvinylfluoride, nylon, fluorocarbon, polycarbonate, polyester,polyacrylate, polyether, polyethylene, polyamide, polyurethane,polystyrene, polypropylene, coformed products thereof, and mixturesthereof.

Desirably, the CMP apparatus further comprises an in situ polishingendpoint detection system, many of which are known in the art.Techniques for inspecting and monitoring the polishing process byanalyzing light or other radiation reflected from a surface of theworkpiece are known in the art. Such methods are described, for example,in U.S. Pat. No. 5,196,353, U.S. Pat. No. 5,433,651, U.S. Pat. No.5,609,511, U.S. Pat. No. 5,643,046, U.S. Pat. No. 5,658,183, U.S. Pat.No. 5,730,642, U.S. Pat. No. 5,838,447, U.S. Pat. No. 5,872,633, U.S.Pat. No. 5,893,796, U.S. Pat. No. 5,949,927, and U.S. Pat. No.5,964,643. Desirably, the inspection or monitoring of the progress ofthe polishing process with respect to a workpiece being polished enablesthe determination of the polishing end-point, i.e., the determination ofwhen to terminate the polishing process with respect to a particularworkpiece.

The following examples further illustrate the invention but, of course,should not be construed as in any way limiting its scope.

In the examples below, the polishing experiments generally involved useof a 50.8 cm (20 inch) diameter polishing tool with 27.6 kPa (4 psi)downforce pressure of the substrate against the polishing pad, 60 rpmplaten speed, 56 rpm carrier speed, 200 mL/min polishing compositionflow rate, and use of in-situ conditioning of a concentric grooved CMPpad.

EXAMPLE 1

This example shows the effect of increasing amounts of apolyethyleneimine having an average molecular weight of 2000 Daltons onremoval rates for silicon nitride and silicon dioxide layers observedwith the polishing compositions of the invention.

Similar silicon nitride layers and silicon dioxide layers wereseparately polished with six different polishing compositions(Compositions 1A-1F). Each of the compositions comprised 0.4 wt. % ceriaand 400 ppm of 4-aminobutyric acid at a pH of 4.9 in water. Composition1A (control) contained no further ingredients (e.g., nopolyethyleneimine). Compositions 1B-1F (invention) further comprisedvarying amounts of polyethyleneimine as set forth in Table 1. Followinguse of the polishing compositions, the silicon nitride (“nitride”) andsilicon dioxide (“oxide”) removal rates were determined, and theselectivities, defined as the ratio of the silicon nitride to silicondioxide removal rates, were calculated. The results are set forth inTable 1. TABLE 1 Effect of increasing levels of polyethyleneimine onsilicon nitride and silicon dioxide removal rates Polyethyl- Polishingeneimine Nitride Rate Oxide Rate Composition (ppm) (Å/min) (Å/min)Selectivity 1A (control) None 950 640 1.5 (control) 1B (invention) 1 970310 3.1 1C (invention) 2 930 180 5.2 1D (invention) 4 920 90 10.2 1E(invention) 6 350 60 5.8 1F (invention) 10 24 10 2.4

As is apparent from the data set forth in Table 1, increasing the amountof polyethyleneimine from none up to 4 ppm resulted in a negligibledecrease in the removal rate of silicon nitride, while the removal ratefor silicon dioxide decreased by approximately 86%. The selectivity asdefined by the ratio of silicon nitride to silicon oxide removal rateincreased from 1.5, with no polyethyleneimine present in the polishingcomposition, to 10.2, with 4 ppm of polyethyleneimine present in thepolishing composition. Increasing the amount of polyethyleneimine in thepolishing composition to 10 ppm resulted in a significant reduction inthe removal rate for both layers. Thus, the results of this exampledemonstrate the dependence of silicon nitride and silicon dioxideremoval rate on the amount of the cationic polymer in the polishingcomposition of the invention.

EXAMPLE 2

This example shows the effect of different cationic polymers on removalrates for silicon nitride and silicon dioxide layers observed with thepolishing compositions of the invention.

Six different polishing compositions were used to separatelychemically-mechanically polish similar silicon nitride layers andsilicon dioxide layers (Compositions 2A-2F). Each of the compositionscomprised 0.4 wt. % ceria and 400 ppm of 4-aminobutyric acid at a pH of4.9 in water. Composition 2A (control) contained no further ingredients(e.g., no cationic polymer). Composition 2B (invention) additionallycontained 8.5 ppm of polyethyleneimine (average molecular weight 25,000Daltons). Composition 2C (invention) additionally contained 15 ppm ofpolydiallyldimethylammonium chloride (average molecular weight 60,000Daltons). Composition 2D (invention) additionally contained 10 ppm of80% ethoxylated polyethyleneimine (average molecular weight 50,000Daltons). Composition 2E (invention) additionally contained 25 ppm ofpolyamidoamine (average molecular weight 1,000,000 Daltons). Followinguse of the polishing compositions, the silicon nitride (“nitride”) andsilicon dioxide (“oxide”) removal rates were determined, and theselectivities, defined by the ratio of the silicon nitride to silicondioxide removal rates, were calculated. The results are set forth inTable 2. TABLE 2 Effect of different cationic polymers on siliconnitride and silicon dioxide removal rates Polishing Nitride Rate OxideRate Composition (Å/min) (Å/min) Selectivity 2A (control) 1012 558 1.82B (invention) 861 33 26 2C (invention) 876 65 13 2D (invention) 1023 8512 2E (invention) 1200 156 7.7

As is apparent from the results set forth in Table 2, all of theinventive polishing compositions decreased the removal rate for silicondioxide compared with the removal rate for silicon nitride, whilemaintaining high removal rates for silicon nitride, as compared to thecontrol polishing composition. The use of polyethyleneimine with anaverage molecular weight of 25,000 daltons (Polishing Composition 2B)notably reduced the removal rate for silicon dioxide approximately 17times, while reducing the silicon nitride removal rate onlyapproximately 15%, as compared to the control polishing composition.Thus, the results of this example demonstrate the effects on removalrates for silicon nitride layers and silicon dioxide layers achievableby the polishing composition of the invention.

EXAMPLE 3

This example shows the effect of cationic polymers comprising differentproportions of a cationic monomer and nonionic monomer on removal ratesfor silicon nitride and silicon dioxide layers observed with thepolishing compositions of the invention.

Five different polishing compositions were used to separatelychemically-mechanically polish similar silicon nitride and silicondioxide layers (Compositions 3A, 3B, 3C, 3D, and 3E). Each of thecompositions comprised ceria and copolymers of acrylamide anddiallyldimethylammonium chloride (“DADMAC”) in water in which the molarfraction of DADMAC units in the copolymers was different. Composition 3Acontained 20 ppm of a 5 mole % DADMAC copolymer with acrylamide.Composition 3B contained 20 ppm of a 15 mole % DADMAC copolymer withacrylamide. Composition 3C contained 20 ppm of a 30 mole % DADMACcopolymer with acrylamide. Composition 3D contained 20 ppm of a 100 mole% DADMAC copolymer with acrylamide (i.e., a homopolymer of DADMAC).Composition 3E contained 100 ppm of a 30 mole % DADMAC copolymer withacrylamide. Following use of the polishing compositions, the siliconnitride (“nitride”) and silicon dioxide (“oxide”) removal rates weredetermined, and the selectivities, defined as the ratio of the siliconnitride to silicon dioxide removal rates, were calculated. The resultsare set forth in Table 3. TABLE 3 Effect of cationic copolymer ofsilicon nitride and silicon dioxide removal rates Cationic CationicNitride Oxide Polishing Polymer Amount Monomer Rate Rate Selec-Composition (ppm) Mole % (Å/min) (Å/min) tivity 3A 20 5 1008 2000 0.5 3B20 15 1005 1732 0.6 3C 20 30 1009 851 1.2 3D 20 100 497 56 8.9 3E 100 301032 63 16.4

As is apparent from the results set forth in Table 3, increasing themolar fraction of cationic monomer in the copolymer from 5 mole % to 30mole % (Polishing Compositions 3A-3C) resulted in an approximately2.4-fold reduction in the oxide removal rate, with negligible effect onnitride rate. The use of the same amount of the corresponding cationichomopolymer (Polishing Composition 3D) reduced the removal rate ofnitride approximately 2-fold as compared to compositions comprising thecationic copolymers, but improved the selectivity to 8.9. The use of agreater amount (i.e., 100 ppm) of a 30 mole % DADMAC-acrylamidecopolymer (Polishing Composition 3E) improved the selectivity ratio to16.4 with a negligible effect on nitride rate. Thus, the results of thisexample demonstrate the effects on removal rates for silicon nitridelayers and silicon dioxide layers achievable by the polishingcomposition of the invention.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein.

The use of the terms “a” and “an” and “the” and similar referents in thecontext of describing the invention (especially in the context of thefollowing claims) are to be construed to cover both the singular and theplural, unless otherwise indicated herein or clearly contradicted bycontext. The terms “comprising,” “having,” “including,” and “containing”are to be construed as open-ended terms (i.e., meaning “including, butnot limited to,”) unless otherwise noted. Recitation of ranges of valuesherein are merely intended to serve as a shorthand method of referringindividually to each separate value falling within the range, unlessotherwise indicated herein, and each separate value is incorporated intothe specification as if it were individually recited herein. All methodsdescribed herein can be performed in any suitable order unless otherwiseindicated herein or otherwise clearly contradicted by context. The useof any and all examples, or exemplary language (e.g., “such as”)provided herein, is intended merely to better illuminate the inventionand does not pose a limitation on the scope of the invention unlessotherwise claimed. No language in the specification should be construedas indicating any non-claimed element as essential to the practice ofthe invention.

Preferred embodiments of this invention are described herein, includingthe best mode known to the inventors for carrying out the invention.Variations of those preferred embodiments may become apparent to thoseof ordinary skill in the art upon reading the foregoing description. Theinventors expect skilled artisans to employ such variations asappropriate, and the inventors intend for the invention to be practicedotherwise than as specifically described herein. Accordingly, thisinvention includes all modifications and equivalents of the subjectmatter recited in the claims appended hereto as permitted by applicablelaw. Moreover, any combination of the above-described elements in allpossible variations thereof is encompassed by the invention unlessotherwise indicated herein or otherwise clearly contradicted by context.

1. A chemical-mechanical polishing composition polishing of substratescomprising silicon nitride and silicon oxide, comprising: (a) a cationicabrasive, (b) a cationic polymer selected from the group consisting of(1) about 0.1 ppm to about 50 ppm of a cationic homopolymer, (2) about0.1 ppm to about 50 ppm of a cationic copolymer comprising at least onecationic monomer and at least one nonionic monomer, wherein the at leastone cationic monomer comprises more than 50% of the cationic copolymeron a molar basis, and (3) about 0.1 ppm to about 200 ppm of a cationiccopolymer comprising at least one cationic monomer and at least onenonionic monomer, wherein the at least one cationic monomer comprises50% or less of the copolymer on a molar basis, and (c) water, whereinthe polishing composition has a pH of about 7 or less.
 2. The polishingcomposition of claim 1, wherein the cationic abrasive is selected fromthe group consisting of alumina, titania, and doped silica.
 3. Thepolishing composition of claim 1, wherein the cationic abrasive isceria.
 4. The polishing composition of claim 1, wherein the cationicabrasive is zirconia.
 5. The polishing composition of claim 1, whereinthe cationic abrasive is present in an amount of about 0.01 wt. % toabout 1 wt. %.
 6. The polishing composition of claim 1, wherein thecationic polymer is a cationic homopolymer.
 7. The polishing compositionof claim 6, wherein the cationic homopolymer is selected from the groupconsisting of ethoxylated polyethyleneimine, polydiallyldimethylammoniumhalide, poly(amidoamine), poly(methacryloyloxyethyltrimethylammonium)chloride, poly(methacryloyloxyethyldimethylbenzylammonium) chloride,poly(vinylpyrrolidone), poly(vinylimidazole), poly(vinylpyridine), andpoly(vinylamine).
 8. The polishing composition of claim 6, wherein thecationic homopolymer is polyethyleneimine.
 9. The polishing compositionof claim 8, wherein polyethyleneimine is present in the polishingcomposition in an amount of about 0.1 ppm to about 20 ppm.
 10. Thepolishing composition of claim 6, wherein the cationic homopolymer is acationic transition metal oligomer.
 11. The polishing composition ofclaim 1, wherein the cationic polymer is a cationic copolymer.
 12. Thepolishing composition of claim 11, wherein the cationic polymercomprises at least one monomer selected from the group consisting ofdiallyldimethylammonium halide, methacryloyloxyethyltrimethylammoniumchloride, methacryloyloxyethyldimethylbenzylammonium chloride,2-aminoethyl methacrylate, N-(3-aminopropyl)methacrylate,vinylimidazole, vinylpyridine, vinylamine, and amidoamine.
 13. Thepolishing composition of claim 11, wherein the cationic monomer isethyleneimine.
 14. The polishing composition of claim 1, wherein thecationic polymer has an average molecular weight of about 5000 Daltonsor more.
 15. The polishing composition of claim 14, wherein the cationicpolymer comprises nitrogen, sulfonium groups, phosphonium groups, or acombination thereof.
 16. The polishing composition of claim 1, whereinthe pH is about 4 to about
 7. 17. The polishing composition of claim 1,wherein the polishing composition further comprises a carboxylic acid.18. The polishing composition of claim 17, wherein the carboxylic acidis an amino carboxylic acid.
 19. A method of chemically-mechanicallypolishing a substrate, which method comprises: (i) contacting asubstrate with a polishing pad and a chemical-mechanical polishingcomposition comprising: (a) a cationic abrasive, (b) a cationic polymerselected from the group consisting of (1) about 0.1 ppm to about 50 ppmof a cationic homopolymer, (2) about 0.1 ppm to about 50 ppm of acationic copolymer comprising at least one cationic monomer and at leastone nonionic monomer, wherein the at least one cationic monomercomprises more than 50% of the cationic copolymer on a molar basis, and(3) about 0.1 ppm to about 200 ppm of a cationic copolymer comprising atleast one cationic monomer and at least one nonionic monomer, whereinthe at least one cationic monomer comprises 50% or less of the copolymeron a molar basis, and (c) water, wherein the polishing composition has apH of about 7 or less, (ii) moving the polishing pad relative to thesubstrate with the chemical-mechanical polishing compositiontherebetween, and (iii) abrading at least a portion of the substrate topolish the substrate.
 20. The method of claim 19, wherein the cationicabrasive is selected from the group consisting of alumina, titania, anddoped silica.
 21. The method of claim 19, wherein the cationic abrasiveis ceria.
 22. The method of claim 19, wherein the cationic abrasive iszirconia.
 23. The method of claim 19, wherein the cationic abrasive ispresent in an amount of about 0.01 wt. % to about 1 wt. %.
 24. Themethod of claim 19, wherein the cationic polymer is a cationichomopolymer.
 25. The method of claim 24, wherein the cationichomopolymer is selected from the group consisting of ethoxylatedpolyethyleneimine, polydiallyldimethylammonium halide, poly(amidoamine),poly(methacryloyloxyethyltrimethylammonium) chloride,poly(methacryloyloxyethyldimethylbenzylammonium) chloride,poly(vinylpyrrolidone), poly(vinylimidazole), poly(vinylpyridine), andpoly(vinylamine).
 26. The method of claim 24, wherein the cationichomopolymer is polyethyleneimine.
 27. The method of claim 26, whereinpolyethyleneimine is present in the polishing composition in an amountof about 0.1 ppm to about 20 ppm.
 28. The method of claim 24, whereinthe cationic homopolymer is a cationic transition metal oligomer. 29.The method of claim 19, wherein the cationic polymer is a cationiccopolymer.
 30. The method of claim 29, wherein the cationic polymercomprises at least one monomer selected from the group consisting ofdiallyldimethylammonium halide, methacryloyloxyethyltrimethylammoniumchloride, methacryloyloxyethyldimethylbenzylammonium chloride,2-aminoethyl methacrylate, N-(3-aminopropyl)methacrylate,vinylimidazole, vinylpyridine, vinylamine, and amidoamine.
 31. Themethod of claim 29, wherein the cationic monomer is ethyleneimine. 32.The method of claim 19, wherein the cationic polymer has an averagemolecular weight of about 5000 Daltons or more.
 33. The method of claim32, wherein the cationic polymer comprises nitrogen, sulfonium groups,phosphonium groups, or a combination thereof.
 34. The method of claim19, wherein the pH is about 4 to about
 7. 35. The method of claim 19,wherein the polishing composition further comprises a carboxylic acid.36. The method of claim 35, wherein the carboxylic acid is an aminocarboxylic acid.